The aim of the work presented was to analyze and present the case study of the change in electronic board testing technology from in-circuit testing to optical inspection, with a focus on improving the quality index of products at Intelbras S/A. In order to make this work possible, the methods of visual inspection, in-circuit tester (ICT), and Automated Optical Inspection (AOI) were described. The Automatic Insertion (SMT) and Wireless Telephone Assembly sectors within Intelbras S/A were presented. Finally, the study that led the company to change its testing method from in-circuit testing to optical inspection was described. The work presented proved to be effective, proving that the optical inspection machines presented a higher quality guarantee than the in-circuit tests, detecting defects that would not have been detected with the previous method.